1.02.15
Schneide- und Plattensäge
The study of materials in geology often forces to collect thin sections or slice samples on their object holders before lapping or polishing, for examination in optical microscopy, microphotography, spectrometry, microprobe, scanning or transmission microscopy.
The slicing machine 1 02 15 is made to saw off the samples bonded on their glass sample holder. The final thickness is limited only by the fragility of the material to be cut. A levelling at 100 microns is easily obtained from samples bonded on permanent or temporary glass sample holders.
The machine uses diamond discs Ø175 for all rocks and straight rocks.
Characteristics
Electrical
- Three phase 230V or 400V 50 Hz
- Power output: 1 kW
Cut mode
Sensitive on a dive. The disc descent is controlled manually. A shock absorber prevents blows while maintaining assessment of penetration effort.
Watering
- By incorporated recycling group
- Capacity 25 litres
Structure of the machine
- Very rigid cast iron frame.
- Easy to equip part support plate.
- None of the devices for moving the workpiece and measuring the thickness are in contact with the watering.
- No corrosion.
Keeping of parts
In geology: by means of a device to maintain the vacuum of the object-carrying blades ensuring a fast and precise positioning.
Thickness adjustment
Screw controlled by max travel micrometer 30 mm.
Adjustment accuracy: 0.01 mm
Presentation
Ready-to-use machine, delivered with:
- Mixed sample holder
- Disc holder assembly Ø 175 mm
- 1 disc for incoming rock Ø 175 mm
- Integrated suction system
- Comes with support cabinet with storage drawer
- incorporating the recycling group
Wir sind für Sie da
Der persönliche Kontakt ist für uns besonders wichtig. Unsere Produkte sind so individuell wie Ihre Anforderungen. Gerne beantworten wir Ihre Fragen und freuen uns auf den Kontakt:
SCAN-DIA GmbH . Lütkenheider Straße 11 . 58099 Hagen
Telefon: +49 23 31 624 69-0